Committees
General co-chairs
- Said Hamdioui (Delft University of Technology, Netherlands)
- Marco Ottavi (University of Rome "Tor Vergata", Italy)
Program co-chairs
- Sandip Kundu (University of Massachusetts, Amherst, USA)
- Salvatore Pontarelli (CNIT, Italy)
Industrial Liasons
- Prashant Joshi (Intel, U.S.A)
Publicity chair
- Antonio Miele (Politecnico di Milano, Italy)
Publication chair
- Qiaoyan Yu (University of New Hampshire, U.S.A.)
Technical Program Committee
- P. Ampadu, University of Rochester
- L. Anghel, TIMA
- C. Bolchini, Politecnico di Milano
- G. Chapman, Simon Fraser University
- L. Chen, University of Saskatchewan
- Y. Choi, Hongik University
- R. Cideciyan, IBM
- A. Cristal, BSC
- A. Daniel, Intel
- S. Das, ARM,
- L. Dilillo, LIRMM
- B. Eklow, CISCO
- O. Ergin, TOBB
- A. Evans, IROC
- M. Fukushi, Yamaguchi University
- D. Gizopoulos, University of Athens
- J. Han, University of Alberta
- C. Huang, Nat’l Tsing Hua University
- N. Jha, Princeton
- W. Jone, University of Cincinnati
- N. Karimi, NY Poly
- R. Karri, NY Poly
- Y. Kim, Northeastern University
- I. Koren, UMASS Amherst
- L. Lastras IBM,
- R. Leveugle, TIMA
- X. Li, Chinese Academy of Science
- H. Li, Chinese Academy of Science
- F. Lombardi, Northeastern University
- C. Metra, University of Bologna
- M. Michael, University of Cyprus
- A. Miele, Politecnico di Milano
- M. Mozaffari Kermani, Rochester Inst. Tech.
- K. Namba, Chiba University
- N. Nicolici, McMaster University
- N. Park, Oklahoma State University
- A. Paschalis, University of Athens
- Z. Peng, Linkoping University
- W. Pleskacz, Warsaw U.T.
- I. Pomeranz, Purdue University
- S. Reddy, University of Iowa
- P. Reviriego, University of Nebrjia
- D. Rossi, University of Bologna
- F. Salice, Politecnico di Milano
- D. Sciuto, Politecnico di Milano
- O. Sinanoglu, N.Y.U. Abu Dhabi
- V. Sridharan, AMD
- M. Tehranipoor, U. Connecticut
- J. Teixeira, Técnica de Lisboa
- C. Thibeault, Ecole de Tech.
- N. Touba, Univ. Texas at Austin
- S. Tragoudas, S. Illinois U. Carbondale
- M. Violante, Politecnico di Torino
- L. Wang, University of Connecticut
- X. Wen, Kyushu Inst. Tech.
- D. Xiang, Tsinghua University
- Q. Yu, University of New Hampshire